Hardware & Compute
Chips, data centres and the infrastructure behind AI.
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Physical constraints of AMD MI400 and OpenAI Stargate timeline
AMD faces significant supply chain risks for its MI400 series chips due to TSMC CoWoS packaging bottlenecks and HBM4 memory production limits.…
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Thermal failures in the age of high-density AI
A voltage transient in the europe-west4-a data hall caused a chiller controller to fail, leading to a 14-hour disruption for 24 private…
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Cerebras WSE-3 dominance in defense AI procurement
Cerebras WSE-3 offers a massive memory bandwidth advantage of 21 petabytes per second, outperforming Nvidia H100 by 7,000 times. This wafer-scale architecture…
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Memory Bandwidth, Not FLOPs, Is What Limits LLM Inference
Accelerators are sold on peak FLOPs, but token generation is bound by how fast weights move out of memory. What to actually…

